Weller WQB2000 Manuel d'utilisateur télécharger pdf

WQB2000 QFP AND BGA REPAIR AND ASSEMBLY SYSTEM

INTRODUCTION

Congratulations! Youve just purchased the most accurate and economical solder re-flow; solder paste printing and component placement machine

on the market! Weller, a company well known for its hand soldering and desoldering tools has developed the WQB2000 to meet a growing need

for accurate removal, solder printing and placement of fine pitch SMDs including BGA components, on prototype and low volume production

PCBs.

With the WQB2000, you will be able to remove fine pitch and ultra-fine pitch surface-mount devices and then screen-print and place these same

devices onto your PC boards with very high yields. The patented templates and solder printing stencils provide a simple, effective, accurate and

repeatable method of solder paste printing and placing of surface-mount devices.

WQB2000 - FEATURES



Requires shop air only 60 psi at 0.70 scfm

 Quiet operation - less than 35 db(A) @ 1 meter

 Air pressure on-off switch, regulator and gauge

 Easy and flexible set-ups, will place components on boards up to

8" x 15"

 Portable Vacuum pencil to aid in component pick-up and location

 Compliant component vacuum pick-up nozzle

 Stencil vacuum pick-up nozzle

 Compact design - 12" x 18" footprint

 One year limited warranty

 Placement and removal of fine pitch components including BGAs

 Soldering and desoldering of fine pitch components including BGAs

 Temperature controlled hot air and radiant bottom heat

 Timer with 20 user programmable cycles to control component/

board heat-up profile

 Solder paste stenciling of individual components

 Placement accuracy of 0.001"

 Repeatability of 0.002" allowing for board to board variation

 Patented, reusable templates and stencils

 Test/Training Kit includes: 1 QFP and 1 BGA component, 2 clear test

boards, 2 copper test boards, templates, stencils, and hot air nozzle

for test components, plastic kit box

WARNING: This product, when used for soldering and similar applications, produces chemicals known to the State of

California to cause cancer and birth defects or other reproductive harm.

The unique features of this machine are its placement accuracy and repeatability. Its accuracy is achieved with precision ball slides and precision

vacuum nozzles, combined with the unique component templates and solder paste stencils. These components keep the placement accuracy

within 0.001".

DESCRIPTION OF MACHINE COMPONENTS

WQB-A HOT AIR UNIT

This unit provides electronic temperature controlled hot air or if desired hot inert gas (such as nitrogen).

The temperature is variable from 250°F to 1000°F. Oil and water free compressed air (30 - 100 psi) must be provided. To meet this requirement a

filter has been provided that will filter oil and water down to 2 PPM. However, as your filter removes oil and water contaminants from the air, the

filter may start to clog and you may notice a pressure drop on the machines air gauge. This may also indicate an air compressor failure. In the

event that the filter clogs call your distributor for a new one.

The hot air will be free of static charge. A static ground is provided at the front of the unit for this purpose.

The unit also provides vacuum source required for component removal during desoldering as well as a hot air flow control adjustment.

WQB-P HOT PLATE UNIT FOR CIRCUIT BOARD BOTTOM HEAT

This unit provides electronic temperature control of the low voltage radiant hot plate heater.

The analog temperature control is variable between 125°F to 825°F. Temperatures can be pre-set and then viewed in real time on a digital display

by switching from pre-set to actual on the selection slide switch provided.

The unit is provided with an external sensor connector for alternatively controlling the bottom temperature of the PC board directly. This sensor is

not included with the WQB2000.

A static ground connector is provided at the rear of the unit.

WQB-C TIMER FOR CYCLE CONTROL

Microprocessor control guarantees reproducible soldering or desoldering time cycles. Optimum results are achieved due to a three stage ramp-up

heating cycle followed by a cool down interval. The microprocessor can store process parameters for up to 10 user programmable cycles, which

can be called up for use or edited and re-stored. There are also 10 preprogrammed cycles in memory. As the Timer is controlling the soldering

process, the time to complete each stage is displayed on a digital count down timer.

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Résumé du contenu

Page 1

1WQB2000 QFP AND BGA REPAIR AND ASSEMBLY SYSTEMINTRODUCTIONCongratulations! Youve just purchased the most accurate and economical solder re-flow; sol

Page 2

2MACHINE PLATFORMThe machine platform is comprised of the following items:Slide AssemblyThe accuracy of the slide assembly is the result of precision

Page 3

3MACHINE OPERATION AND TEST 1. Turn on air supply with toggle switch at the top center of housing (see Figure 1). If no air pressure is evident, check

Page 4

46. Turn on the WQB-P power supply. Check the WQB-C Timer to verify that the LEDs are lighted. If not, turn off WQB-P power supply andcheck connector

Page 5 - LIGNMENT TEMPLATES

5NOTE: The down stop may have to be adjusted so that the vacuum cup just comes in contact with the components top surface whileallowing the nozzle to

Page 6 - MAINTENANCE

6ALIGNMENT METHOD - COMPONENT TO CIRCUIT BOARD1. Return the circuit board to the registration pins; seat board to pin shoulders, level board with spac

Page 7 - Used to keep PCB level

187FIGURE 5FIGURE 1TAPESTENCIL VACUUM NOZZLEALIGNMENT NOTCHSTANDOFF BLOCKUsed to keep PCB levelSTANDOFF REGISTRATION PINUsed if parts are present on b

Page 8 - CUSTOMER SERVICES

8ADDITIONAL COMPANION PRODUCTS AVAILABLE WPRB1000 Plastic BGA Re-balling Kit WCRB1000 Ceramic BGA Re-balling Kit WLSK1000 QFP Lead Straightening Ki

Page 9

9FIGURE 4TYPICAL BGA COMPONENT TEMPLATE TYPICAL QFP COMPONENT TEMPLATESIGHT HOLES,CORNERS ONLYLEAD ALIGNMENTDEPRESSIONSNOZZLEALIGNMENTTA BWINDOWSTENCI